Consistent with Brad Perkins, product form director at Nordson Test & Inspection. “Glass substrates have their own sets of challenges. When you look at a 500-plus millimeter square for those large glass panels, you run into some challenges with how much that bends and warps, and then how do you hold them?”
The GripJet™ vacuum degree employs the SmartNozzle™ selective vacuum era with a patent-pending GripJet current amplifier to generate a formidable vacuum pressure, successfully gripping and pulling down extremely warped panels right into a flat degree. This leading edge vacuum degree era gets rid of the reliance on conventional comfortable vacuum pads, mechanical clamping mechanisms, or the significance of profusion vacuum pump (as regularly wanted for same old vacuum levels) to effect enhanced productiveness, lowered breakage, loose price, advanced submit and greater device uptime.
The GripJet™ vacuum degree is to be had for same old trade panel measurement equivalent to 510 mm X 515 mm and alternative custom designed measurement for Glass and Copper clad flat panels of diverse thickness and warpages. The GripJet™ degree was once designed for seamless integration into present manufacturing gear with 3 mechanical touch issues, 4 10 mm same old vacuum tubes and one CDA enter. Not obligatory edge exclusion model and raise pins mechanism are to be had on request.
“We are thrilled to be among the first in the market to offer an efficient, production-ready solution for the emerging panel-level packaging market,” stated Alon Kapel, Vice President of Gross sales and Advertising and marketing at CoreFlow. “The GripJet™ vacuum stage gives tools manufacturers a time-to-market advantage by providing a straightforward, easy integration and field proven solution for handling and flattening highly warped panels with easy integration into FOPLP metrology, inspection (AOI), and various atmospheric process tools. CoreFlow also provides build-to-print GripJet™ stages, ensuring optimal integration into OEM environment.
About CoreFlow Ltd.
CoreFlow Ltd. (www.coreflow.com) is a leading developer and manufacturer of advanced substrate handling systems for the semiconductor and flat panel display (FPD) industries. Since 1999, CoreFlow has been at the forefront of innovation, with patented aeromechanical handling solutions that are deployed globally. The company’s headquarters and R&D center are located in Daliat-El Carmel, Mt. Carmel, Israel, with manufacturing, sales, and customer support operations in Korea, Taiwan, Japan, and China. For inquiries, touch us at [email protected].
Media and Funding Touch:
Mr. Alon Kapel, VP gross sales and advertising. CoreFlow Ltd. [email protected]
Mr. Alon Segal, CEO, CoreFlow Ltd. [email protected]
Video: https://www.youtube.com/watch?v=PeBkpkZmgqQ
Photograph: https://mma.prnewswire.com/media/2509621/CoreFlow_1.jpg
Photograph: https://mma.prnewswire.com/media/2509622/CoreFlow_2.jpg
SOURCE CoreFlow Ltd
