Title: Fibocom Showcases AIoT Solutions with MediaTek at Mobile World Congress 2025
In a major demonstration at Mobile World Congress 2025 in Barcelona, Spain, Fibocom (Stock code: 300638) showcased its cutting-edge MTK T830-based 5G Module FG370 in collaboration with MediaTek. This innovative module features Modem AI, 3Tx technology, and L4S technology, addressing the critical needs of leading global operators for advanced 5G Fixed Wireless Access (FWA) solutions and Mobile HotSpot (MHS) applications.
The FG370, powered by MediaTek Modem AI (MMAI), offers enhanced network connectivity in challenging environments such as high-speed rail, underground areas, airports, and remote suburban locations. The AI-driven network prediction capabilities significantly boost network search speed, optimize weak signals, and improve energy efficiency in various scenarios, resulting in faster and more stable connections.
Traditionally, 5G terminals have been limited to two transmission chains, hindering uplink throughput. However, the FG370’s 3Tx technology enables terminals to support three transmission chains, significantly enhancing uplink throughput. Combining this with L4S technology results in a low-latency, low-loss, and scalable network experience, delivering increased bandwidth and reduced latency.
Moreover, the FG370 supports 8Rx and 3GPP Rel-17 standards, enhancing signal quality and throughput at the cell edge. This advanced technology, in collaboration with MediaTek, positions Fibocom as a key player in the development of high-performance FWA and MHS solutions.
Evan Su, General Manager of Wireless Communications at MediaTek, emphasized the importance of AI in the 5G FWA and MHS sectors, highlighting the collaboration with Fibocom to introduce new features and applications for optimized network selection. Simon Tao, VP of MBB Product Management Dept. at Fibocom, expressed commitment to advancing AI and supporting key 5G technologies to drive innovation in the deployment of 5G AI FWA and MHS solutions.
The integration of MediaTek’s Modem AI and advanced 5G technologies in Fibocom’s FG370 module showcases a pivotal solution for high-performance FWA and MHS offerings. Through strategic partnerships and a strong presence at Mobile World Congress, Fibocom is positioned to lead the evolution of smart, connected networks worldwide.
Visit Fibocom’s booth #5I33 at Mobile World Congress to experience their innovative solutions firsthand and join in advancing connectivity for an intelligent future.
In conclusion, the collaboration between Fibocom and MediaTek represents a significant advancement in AIoT solutions for the 5G FWA and MHS sectors. The FG370’s advanced features and technologies demonstrate a commitment to delivering smarter, more efficient, and stable connectivity solutions. As the industry continues to evolve, Fibocom remains at the forefront of innovation, driving the development of high-performance FWA and MHS offerings. Join us in shaping the future of connectivity and explore the possibilities of intelligent 5G solutions.
